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Results of search for 'su:"Solder and soldering."'
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Authors
Bath, Jasbir
Handwerker, Carol A.
Kato, Takahiko
Shangguan, Dongkai
Series
Quality and Reliabil...
Wiley Series on Proc...
Topics
Electronic packaging
Lead-free electronic...
Microelectronic pack...
Solder and soldering
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1.
Lead-Free Soldering Process Development and Reliability.
by
Bath, Jasbir
Series:
Quality and Reliability Engineering Series
Edition:
1st ed.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Newark :
John Wiley & Sons, Incorporated,
2020
Copyright date:
©2020
Online resources:
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Availability:
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2.
Lead-Free Solder Interconnect Reliability.
by
Shangguan, Dongkai
Edition:
1st ed.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Materials Park :
A S M International,
2005
Copyright date:
©2005
Online resources:
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Availability:
No items available.
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3.
Mitigating Tin Whisker Risks : Theory and Practice.
by
Kato, Takahiko
Handwerker, Carol A
Bath, Jasbir
Series:
Wiley Series on Processing of Engineering Materials Series
Edition:
1st ed.
Material type:
Text
; Format:
available online
; Literary form:
Not fiction
Publisher:
Newark :
John Wiley & Sons, Incorporated,
2016
Copyright date:
©2016
Online resources:
Click to View
Availability:
No items available.
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