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Lead-Free Solder Interconnect Reliability.

By: Material type: TextTextPublisher: Materials Park : A S M International, 2005Copyright date: ©2005Edition: 1st edDescription: 1 online resource (302 pages)Content type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9781615030934
Subject(s): Genre/Form: Additional physical formats: Print version:: Lead-Free Solder Interconnect ReliabilityDDC classification:
  • 621.381/046
LOC classification:
  • TK7870.15 .L425 2005
Online resources:
Contents:
Intro -- Contents -- Foreword -- Preface -- Lead-Free Soldering and Environmental Compliance: An Overview -- Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects -- Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties -- Lead-Free Solder Joint Reliability Trends -- Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects -- Tin Whisker Growth on Lead-Free Solder Finishes -- Accelerated Testing Methodology for Lead-Free Solder Interconnects -- Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects -- Design for Reliability-Finite Element Modeling of Lead-Free Solder Interconnects -- Characterization and Failure Analyses of Lead-Free Solder Defects -- Reliability of Interconnects with Conductive Adhesives -- Lead-Free Solder Interconnect Reliability Outlook -- Index.
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Intro -- Contents -- Foreword -- Preface -- Lead-Free Soldering and Environmental Compliance: An Overview -- Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects -- Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties -- Lead-Free Solder Joint Reliability Trends -- Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects -- Tin Whisker Growth on Lead-Free Solder Finishes -- Accelerated Testing Methodology for Lead-Free Solder Interconnects -- Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects -- Design for Reliability-Finite Element Modeling of Lead-Free Solder Interconnects -- Characterization and Failure Analyses of Lead-Free Solder Defects -- Reliability of Interconnects with Conductive Adhesives -- Lead-Free Solder Interconnect Reliability Outlook -- Index.

Description based on publisher supplied metadata and other sources.

Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2024. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.

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