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Electronic Materials.

By: Material type: TextTextSeries: Materials Science Foundations SeriesPublisher: Zurich : Trans Tech Publications, Limited, 2010Copyright date: ©2010Edition: 1st edDescription: 1 online resource (484 pages)Content type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9783038134435
Genre/Form: Additional physical formats: Print version:: Electronic MaterialsDDC classification:
  • 621.3815
LOC classification:
  • TK7871 -- .K88 2010eb
Online resources:
Contents:
Intro -- Electronic Materials -- Preamble -- Table of Contents -- Table of Contents -- Chapter I. THE BASIC STRUCTURES OF SOLIDS -- I-1. Introduction. I-2. Atoms and Binding Forces -- I-3. Crystal Structures -- I-4. Crystalline Solids -- I-5. Polycrystalline and Non-Crystalline Solids -- I-6. The Phase Diagrams -- I-7. Techniques on Crystal Growth and Thin Film Deposition -- I-8. Crystal Imperfection -- I-9. Diffusion in Solids -- I-10. Physical Diagnostic Tools -- Glossary -- References -- Exercises for Chapter I -- Chapter II. ELECTRICAL PROPERTIES OF SOLIDS -- II-1. Introduction. II-2. Electrons in a Solid -- II-3. Energy Distribution of the Electrons -- II-4. The Energy Band Diagram -- II-5. Mathematical Formulation of the Conduction Processes -- II-6. Conductors -- II-7. Semiconductors -- II-8. Other Conduction Mechanisms -- II-9. Velocity Saturation and Negative-Resistance Effect -- II-10. Insulators -- Glossary for End-of-Chapter Review -- References -- Exercises for Chapter II -- Chapter III. P-N JUNCTIONS AND RELATED DEVICES -- III-1. Introduction. III-2. Concept of a P-N Junction -- III-3. Schottky Junction and its Electronic Properties -- III-4. Metal-Semiconductor Contact -- III-5. MIS Junction and Field-Effect Properties -- III-6. Materials Considerations -- III-7. Structures and Operation of Transistors -- III-8. Non-Ideal Effects and other Performance Parameters -- III-9. New Transistors -- Glossary for End-of-Chapter Review -- References -- Exercises for Chapter III -- Chapter IV. OPTICAL PROPERTIES OF SOLIDS -- IV-1. Introduction. IV-2. Review of the Properties of Light -- IV-3. The Absorption Process -- IV-4. The Emission Process -- IV-5. Imagers -- IV-6. Displays -- IV-7. Power Generation -- IV-8. Optical Signal Transmission Media -- Glossary -- References -- Exercises for Chapter IV.
Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDS -- V-1. Introduction -- V-2. Magnetic Properties of Solids -- V-3. Sources of Magnetization -- V-4. Magnetic Anisotropy and Invar Alloys -- V-5. Amorphous Magnetic Materials -- V-6. Soft Magnets and Hard Magnets -- V-7. Magnetic Devices and Applications -- V-8. Properties of Superconductors -- V-9. Applications of Superconductors -- V-10. Superconducting Materials -- Glossary for End-of-Chapter Review -- References -- Exercises for Chapter V -- Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS -- VI-1. Introduction. VI-2. Micromachining -- VI-3. Polysilicon Films Used in Micro-Structures -- VI-4. Applications of Micro-Structures -- VI-5. Heat and Temperature Sensors -- VI-6. Displacement and Flow Sensors -- VI-7. Chemical Sensors -- VI-8. Optical Sensors -- VI-9. Design of a Pressure Transducer -- VI-10. Grounding, Shielding and Interference -- VI-11. Packaging Materials -- Glossary for End-of-Chapter Review -- References -- ˘ ˇˆ˙˝˛ ˚˜ ˘ ˇˆ˙˝˛ ˚˜ Exercises for Chapter VI -- Appendix.
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Intro -- Electronic Materials -- Preamble -- Table of Contents -- Table of Contents -- Chapter I. THE BASIC STRUCTURES OF SOLIDS -- I-1. Introduction. I-2. Atoms and Binding Forces -- I-3. Crystal Structures -- I-4. Crystalline Solids -- I-5. Polycrystalline and Non-Crystalline Solids -- I-6. The Phase Diagrams -- I-7. Techniques on Crystal Growth and Thin Film Deposition -- I-8. Crystal Imperfection -- I-9. Diffusion in Solids -- I-10. Physical Diagnostic Tools -- Glossary -- References -- Exercises for Chapter I -- Chapter II. ELECTRICAL PROPERTIES OF SOLIDS -- II-1. Introduction. II-2. Electrons in a Solid -- II-3. Energy Distribution of the Electrons -- II-4. The Energy Band Diagram -- II-5. Mathematical Formulation of the Conduction Processes -- II-6. Conductors -- II-7. Semiconductors -- II-8. Other Conduction Mechanisms -- II-9. Velocity Saturation and Negative-Resistance Effect -- II-10. Insulators -- Glossary for End-of-Chapter Review -- References -- Exercises for Chapter II -- Chapter III. P-N JUNCTIONS AND RELATED DEVICES -- III-1. Introduction. III-2. Concept of a P-N Junction -- III-3. Schottky Junction and its Electronic Properties -- III-4. Metal-Semiconductor Contact -- III-5. MIS Junction and Field-Effect Properties -- III-6. Materials Considerations -- III-7. Structures and Operation of Transistors -- III-8. Non-Ideal Effects and other Performance Parameters -- III-9. New Transistors -- Glossary for End-of-Chapter Review -- References -- Exercises for Chapter III -- Chapter IV. OPTICAL PROPERTIES OF SOLIDS -- IV-1. Introduction. IV-2. Review of the Properties of Light -- IV-3. The Absorption Process -- IV-4. The Emission Process -- IV-5. Imagers -- IV-6. Displays -- IV-7. Power Generation -- IV-8. Optical Signal Transmission Media -- Glossary -- References -- Exercises for Chapter IV.

Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDS -- V-1. Introduction -- V-2. Magnetic Properties of Solids -- V-3. Sources of Magnetization -- V-4. Magnetic Anisotropy and Invar Alloys -- V-5. Amorphous Magnetic Materials -- V-6. Soft Magnets and Hard Magnets -- V-7. Magnetic Devices and Applications -- V-8. Properties of Superconductors -- V-9. Applications of Superconductors -- V-10. Superconducting Materials -- Glossary for End-of-Chapter Review -- References -- Exercises for Chapter V -- Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS -- VI-1. Introduction. VI-2. Micromachining -- VI-3. Polysilicon Films Used in Micro-Structures -- VI-4. Applications of Micro-Structures -- VI-5. Heat and Temperature Sensors -- VI-6. Displacement and Flow Sensors -- VI-7. Chemical Sensors -- VI-8. Optical Sensors -- VI-9. Design of a Pressure Transducer -- VI-10. Grounding, Shielding and Interference -- VI-11. Packaging Materials -- Glossary for End-of-Chapter Review -- References -- ˘ ˇˆ˙˝˛ ˚˜ ˘ ˇˆ˙˝˛ ˚˜ Exercises for Chapter VI -- Appendix.

Description based on publisher supplied metadata and other sources.

Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2024. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.

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