11th International Congress Molded Interconnect Devices - Scientific Proceedings.

Intro -- 11th International Congress Molded Interconnect Devices - Scientific Proceedings -- Preface and Committees -- Table of Contents -- Chapter 1: Development and Prototyping -- Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices -- Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools -- Optimized Process Sequences for Prototyping of Molded Interconnect Devices -- Integration of Functional Circuits into FDM Parts -- Chapter 2: Printing Technologies -- Printing of Functional Structures on Molded 3D Devices -- Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing -- Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing -- Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing -- Chapter 3: Materials and Manufacturing -- Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz -- Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method -- Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography -- MID Fabricated by Ultrasonic Processing -- Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation -- Chapter 4: Manufacturing Processes -- Study of MID Technologies for Automotive Lighting and Light Signaling Devices -- Chapter 5: Assembly Technologies and Inspection -- Design and Solder Process Optimization in MID Technology for High Power Applications -- Chapter 6: Quality and Reliability.

Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID -- Keywords Index -- Authors Index.

Selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.

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Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2024. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.