Cover -- THERMAL MANAGEMENT OF ELECTRONICS, VOLUME II -- Contents -- List of Figures -- List of Tables -- Abbreviations -- Notations -- Preface -- Acknowledgments -- Chapter 1: Introduction -- 1.1: Background -- 1.2: Possible Cooling Strategies -- 1.2.1: Active Cooling -- 1.2.2: Passive Cooling -- 1.3: Advantages of Passive Cooling Techniques over Active Cooling Methods -- 1.4: Phase Change Materials -- 1.5: Optimization of Systems -- 1.5.1: Optimization Techniques -- 1.6: Organization of the Book -- 1.7: Conclusion -- Chapter 2: Review of Literature -- 2.1: Introduction -- 2.2: Studies on Metal Foam-Filled PCM-Based Heat Sinks -- 2.3: Optimization of PCM-Based Composite Heat Sinks -- 2.4: Optimization Strategies in Thermal Systems -- 2.5: Scope and Objectives of the Present Study -- 2.6: Conclusion -- Chapter 3: Characterization of PCM and TCE -- 3.1: Introduction -- 3.2: Selection of Phase Change Material -- 3.3: Thermal Conductivity Enhancer -- 3.4: Measurement Techniques to Determine Latent Heat of Fusion, Melting, and Specific Heat -- 3.5: SEM Analysis of Aluminum -- 3.6: DSC and MDSC Analysis of N-Eicosane -- 3.7: DSC Analysis of Paraffin Wax -- 3.8: Open-Cell Metal Foams -- 3.9: Conclusion -- Chapter 4: Experimental Setup and Methodology -- 4.1: Introduction -- 4.2: Experimental Setup and Methodology -- 4.2.1: Heat Sink Assembly -- 4.2.2: Plate Heater -- 4.2.3: Thermocouple Positions -- 4.2.4: Experimental Arrangement -- 4.3: Instrumentation -- 4.3.1: Data Acquisition System -- 4.3.2: Thermocouples -- 4.3.3: Digital Multimeter -- 4.3.4: Electronic Mass Balance -- 4.3.5: Experimental Procedure -- 4.3.6: Uncertainty in Measurements -- 4.3.7: Repeatability in Measurements -- 4.4: Conclusion -- Chapter 5: Thermal Performance and Optimization of Pin Fin Heat Sinks -- 5.1: Introduction -- 5.2: Experimental Setup. 5.3: Definitions Used in the Present Study -- 5.4: Artificial Neural Network -- 5.5: Results and Discussion -- 5.5.1: Melting and Solidification Patterns of Different PCMs -- 5.5.2: Spatial Variation of Temperature within the PCM -- 5.5.3: Comparison of Heat Sinks with Different Volume Fractions of the PCM for N-Eicosane-Based Heat Sinks -- 5.5.4: Comparison of Different Volume Fractions of the PCM, Paraffin Wax, Used in the 72 Pin Fin Heat Sink -- 5.5.5: Effect of Orientation on the Thermal Performance of the 72 Pin Fin Heat Sink -- 5.5.6: Enhancement in the Operation Time with Different Heat Sinks Using N-Eicosane as PCM -- 5.5.7: Enhancement in the Operating Time for Different Volumetric Fractions of Paraffin Wax in the 72 Pin Fin Heat Sink -- 5.6: Optimization of Heat Sinks with N-Eicosane -- 5.6.1: Introduction to Genetic Algorithms -- 5.6.2: Methodology for the Optimization of Pin Fin-Based Heat Sinks -- 5.7: Performance of the Optimal Configuration for the Paraffin Wax -- 5.8: Summary -- 5.9: Conclusion -- Chapter 6: Performance Studies on Metal Foam-Filled PCM -Based Heat Sinks -- 6.1: Introduction -- 6.2: Experimental Setup -- 6.2.1: Tracking Mechanism -- 6.3: Results and Discussion -- 6.3.1: Effect of Metal Foam and PCM on Heat Transfer Performance -- 6.3.2: Comparison of the Thermal Performance of Copper and Aluminum Metal Foam-Filled PCM-Based Heat Sinks -- 6.3.3: Effect of Orientation on the Heat Transfer Performance -- 6.3.4: Comparison of the Thermal Performances of Aluminum Metal Foam-Filled PCM-based Heat Sinks and PCM-Based Pin Fin Heat Sinks -- 6.4: Summary -- 6.5: Conclusion -- Chapter 7: Deductions and Suggestions for Future Work -- 7.1: Introduction -- 7.2: Major Conclusions of the Present Study -- 7.3: A Grand Overview of the Present Study Reported in Volume I and Volume II -- 7.4: Suggestions for Future Work. 7.5: Recent Developments in PCM-Based Heat Sinks -- 7.6: Conclusion -- Appendix A: Schematic Diagrams of Various Heat Sinks Used in the Present Study -- References -- List of Publications Used For The Book -- About the Authors -- Index -- Ad Page -- Back Cover.