Plasma Processing of Materials : (Record no. 83858)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04318nam a22004453i 4500 |
| 001 - CONTROL NUMBER | |
| control field | EBC3376299 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | MiAaPQ |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20240729125241.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d | |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr cnu|||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 240724s1991 xx o ||||0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780309583756 |
| Qualifying information | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9780309045971 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (MiAaPQ)EBC3376299 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (Au-PeEL)EBL3376299 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (CaPaEBR)ebr10055392 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)923262698 |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | MiAaPQ |
| Language of cataloging | eng |
| Description conventions | rda |
| -- | pn |
| Transcribing agency | MiAaPQ |
| Modifying agency | MiAaPQ |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TA2005 -- .N37 1991eb |
| 082 0# - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.044 |
| 245 10 - TITLE STATEMENT | |
| Title | Plasma Processing of Materials : |
| Remainder of title | Scientific Opportunities and Technological Challenges. |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 1st ed. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Washington, D.C. : |
| Name of producer, publisher, distributor, manufacturer | National Academies Press, |
| Date of production, publication, distribution, manufacture, or copyright notice | 1991. |
| 264 #4 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Date of production, publication, distribution, manufacture, or copyright notice | ©1991. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource (87 pages) |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Plasma Processing of Materials: -- Copyright -- Preface -- Acknowledgments -- Contents -- 1 Summary, Findings, Conclusions, And Recommendations -- SUMMARY -- FINDINGS, CONCLUSIONS, AND RECOMMENDATIONS -- 2 Plasma Processing And Low-Energy Plasma Science -- CLASSIFICATION OF PLASMAS -- BRIEF HISTORY OF LOW-ENERGY PLASMA SCIENCE AND TECHNOLOGY -- INDUSTRIAL APPLICATIONS OF PLASMA PROCESSING OF MATERIALS -- INTERFACE BETWEEN BASIC PLASMA SCIENCE AND APPLICATIONS -- SCOPE OF THIS REPORT -- 3 Plasma Processing In The Electronics Industry -- MICROELECTRONICS FABRICATION -- PLASMA ETCHING -- Anisotropy -- Selectivity -- Uniformity -- Damage -- New Materials -- PLASMA DEPOSITION -- Planarization, Filling, and Interconnection -- Surface Modification -- New Materials -- PLASMA CLEANING -- LOW-PRESSURE PLASMA REACTOR TECHNOLOGY -- Single-Wafer Processing -- Process Control -- New Plasma Sources -- Magnetic Confinement -- Downstream Processing -- Modulated Processing -- Clustered Processing -- THERMAL PLASMA REACTOR TECHNOLOGY -- TOWARD FLEXIBLE MICROELECTRONICS MANUFACTURING -- FINDINGS AND CONCLUSIONS -- 4 Scientific Foundation of Plasma Processing -- SURFACE PROCESSES -- Theory and Simulation -- Experimental Studies -- Beam-Surface Experiments -- Ex Situ Analysis -- PLASMA GENERATION AND TRANSPORT -- Low-Pressure Plasma Modeling -- Analysis -- Fluid Simulations -- Particle-In-Cell and Kinetic Simulations -- Thermal Plasma Modeling -- Toward Cad Tools And Expert Systems -- Chemical Kinetics -- Multidimensional Modeling and Magnetic Effects -- Stability of Processing Plasmas -- Accuracy and Reliability of Numerical Simulation Methods -- Plasma Diagnostics -- Positive Ions and Neutrals -- Electron Density and Energy Distribution -- Fields -- Negative Ions -- Particulates -- Reference Reactors -- Data Base for Plasma Generation and Transport -- Present Status. |
| 505 8# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Needs -- Distribution of Information -- PLASMA-SURFACE INTERACTIONS -- Boundary Conditions -- Passive Surfaces -- Particulates -- Microstructure Evolution -- In Situ Analysis -- FUNDING FOR PLASMA PROCESSING RESEARCH -- Japanese Research -- French Research -- FINDINGS AND CONCLUSIONS -- 5 Educational Issues -- EDUCATIONAL REQUIREMENTS FOR UNDERGRADUATES -- Laboratory Courses and the Scientific Method -- Research Experiences and Cooperative Programs -- U.S. GRADUATE EDUCATION -- TEXTS AND COMPUTER-AIDED INSTRUCTION -- FACULTY DEVELOPMENT -- CONTINUING EDUCATION -- FOREIGN EDUCATIONAL OFFERINGS -- Japan -- France -- FINDINGS AND CONCLUSIONS -- Appendix Participants in Workshop on Plasma Processing of Materials. |
| 588 ## - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Description based on publisher supplied metadata and other sources. |
| 590 ## - LOCAL NOTE (RLIN) | |
| Local note | Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2024. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Plasma engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronics -- Materials -- Effect of radiation on. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Surfaces (Technology). |
| 655 #4 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Print version: |
| Main entry heading | |
| Title | Plasma Processing of Materials |
| Place, publisher, and date of publication | Washington, D.C. : National Academies Press,c1991 |
| International Standard Book Number | 9780309045971 |
| 797 2# - LOCAL ADDED ENTRY--CORPORATE NAME (RLIN) | |
| Corporate name or jurisdiction name as entry element | ProQuest (Firm) |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://ebookcentral.proquest.com/lib/orpp/detail.action?docID=3376299">https://ebookcentral.proquest.com/lib/orpp/detail.action?docID=3376299</a> |
| Public note | Click to View |
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