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High Speed Digital Design : (Record no. 55160)

MARC details
000 -LEADER
fixed length control field 07517nam a22004933i 4500
001 - CONTROL NUMBER
control field EBC2166539
003 - CONTROL NUMBER IDENTIFIER
control field MiAaPQ
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20240729123844.0
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS
fixed length control field m o d |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr cnu||||||||
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 240724s2015 xx o ||||0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780124186675
Qualifying information (electronic bk.)
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
Canceled/invalid ISBN 9780124186637
035 ## - SYSTEM CONTROL NUMBER
System control number (MiAaPQ)EBC2166539
035 ## - SYSTEM CONTROL NUMBER
System control number (Au-PeEL)EBL2166539
035 ## - SYSTEM CONTROL NUMBER
System control number (CaPaEBR)ebr11090975
035 ## - SYSTEM CONTROL NUMBER
System control number (CaONFJC)MIL823217
035 ## - SYSTEM CONTROL NUMBER
System control number (OCoLC)922847744
040 ## - CATALOGING SOURCE
Original cataloging agency MiAaPQ
Language of cataloging eng
Description conventions rda
-- pn
Transcribing agency MiAaPQ
Modifying agency MiAaPQ
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7868.D5.Z43 2015
082 0# - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3/98
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Zhang, Hanqiao.
245 10 - TITLE STATEMENT
Title High Speed Digital Design :
Remainder of title Design of High Speed Interconnects and Signaling.
250 ## - EDITION STATEMENT
Edition statement 1st ed.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture San Diego :
Name of producer, publisher, distributor, manufacturer Elsevier Science & Technology,
Date of production, publication, distribution, manufacture, or copyright notice 2015.
264 #4 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Date of production, publication, distribution, manufacture, or copyright notice ©2015.
300 ## - PHYSICAL DESCRIPTION
Extent 1 online resource (268 pages)
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Front Cover -- High Speed Digital Design -- Copyright Page -- Contents -- About the Authors/Contributors -- 1 Transmission line fundamentals -- Basic Electromagnetics -- Electromagnetics Field Theory -- Maxwell's equations -- Ampere's law -- Faraday's law -- Gauss's law -- Gauss's law for magnetism -- Propagation of Plane Waves -- Uniform plane wave -- Uniform plane wave in conductive media -- Power flow and the Poynting vector -- Transmission Line Theory -- Wave Equations on Lossless Transmission Lines -- Lossless transmission line -- Wave propagation on a lossless transmission line -- Incident waves and reflected waves -- Impedance, Reflection Coefficient, and Power Flow on a Lossless Transmission Line -- Input impedance and reflection coefficient -- Power flow on a lossless transmission line -- Traveling and Standing Waves on a Transmission Line -- Traveling waves -- Standing waves -- Transmission Line Structures -- Stripline -- Microstrip -- Coplanar Waveguides -- Novel Transmission Lines -- References -- 2 PCB design for signal integrity -- Differential Signaling -- Impedance -- Time Domain Analysis -- Eye Diagram -- Jitter -- Jitter components and budget -- Jitter amplification example -- Frequency Domain Analysis -- Spectral Content -- Insertion Loss -- Integrated Insertion Loss Noise -- Return Loss -- S11 nulls -- Crosstalk -- Crosstalk sum -- Integrated Crosstalk -- Signal-to-Noise Ratio -- Stack-Up Design -- Impedance Target (Routing Impedance) -- Optimal routing impedance -- PCB Losses -- Dielectric Loss -- Lower loss dielectrics -- Hybrid stackups -- Conductor Loss -- Surface roughness -- Crosstalk Mitigation through StackUp -- Stripline dielectric -- Solder mask -- Dual Stripline -- PCB stackup -- Angled routing -- Parallelism -- Densely Broadside Coupled Dual Stripline -- Via Stub Mitigation -- Impedance optimization -- U-turn via.
505 8# - FORMATTED CONTENTS NOTE
Formatted contents note Back-drilling -- Blind and buried via -- PCB Layout Optimization -- Length Matching -- Fiber Weave Effect -- Crosstalk Reduction -- Interleaving -- Guard trace -- Signal-to-ground ratio -- Ground placement -- Orthogonal placement -- Component (vertical to horizontal) cancellation -- Non-Ideal Return Path -- Power Integrity -- Repeaters -- Introduction to re-timers -- Introduction to re-drivers -- Modeling and simulation -- PCIe considerations -- References -- 3 Channel modeling and simulation -- Transmission Lines -- Causality -- Checking for Model Causality -- Causal Frequency-Dependent Model -- Copper Surface Roughness -- Modified Hammerstad model -- Huray model -- Conductivity -- Environmental Impact -- Humidity -- Conductivity -- Temperature -- Model and simulation -- Model Geometries -- Stripline structures -- Microstrip structures -- Corner Models -- Iterative corner model -- Monte Carlo corner model -- Ideal Assumptions: Homogeneous Impedance -- Ideal Assumptions: Crosstalk Aggressors -- Transmitters -- IBIS Models -- Spice Voltage Source Model -- Linearity test -- 3D Modeling -- Ports/Terminals -- Wave ports -- Lumped ports -- Model Analysis Settings -- Discrete or interpolating solutions -- Frequency range and step size -- Port order -- Normalize result to 50ohms -- Plated-Through-Hole Via -- Model Techniques -- Pre-Layout Approximation -- Pre-Layout Modeling -- Post-Layout -- Connectors -- Connector Variability -- Signal Selection -- Separated Via Models -- Unconnected Pins -- Physical Features -- Design Optimization -- Voiding edge fingers -- Voiding SMT connector pads -- Packages -- C4 Escape -- Transmission Line -- PTH Via -- BGA Model -- Signal Selection for 3D Package Structures -- References -- 4 Link circuits and architecture -- Types of Link Circuit Architectures -- Embedded Clock Architecture -- Forwarded Clock Architecture.
505 8# - FORMATTED CONTENTS NOTE
Formatted contents note Termination -- DC and AC Coupling -- Termination Type -- Termination Circuits -- Termination Calibration Circuits -- Termination Detection Circuits -- Transmitter -- Transmitter Equalization -- Transmitter Data Path -- Current-Mode Driver -- Voltage-Mode Driver -- Receiver -- Receiver Equalization -- Receiver Data Path -- Continuous-Time Linear Equalizer -- Decision Feedback Equalizer -- Data Sampler -- Error Sampler -- Receiver Calibration -- Receiver Adaptation -- Clock and Data Recovery -- Clock and Data Recovery Loop -- Phase Detectors -- Forwarded Clock Receiver -- Delay-Locked Loop -- Design for Test/Manufacture -- Analog DFx Features -- Digital DFx Features -- References -- 5 Measurement and data acquisition techniques -- Digital Oscilloscope Measurement -- Real-Time and Equivalent-Time Sampling Scopes -- Bandwidth -- Scope Digital Filter Applications -- TDR Measurements -- De-skew Differential Pairs with TDR -- Channel Characterization with TDR -- Return Loss Measurement with TDR -- Vector Network Analyzer Measurement -- What is VNA? -- VNA Error Sources and Calibration -- Full Two-Port SOLT Calibration Procedure -- Example of Measurement Using VNA -- VNA Measurement Procedure -- References -- 6 Designing and validating with Intel processors -- Designing Systems with Intel Devices -- Interconnect Model -- Equalization Models -- Transmit feed forward equalization -- Continuous time linear equalizer -- Decision feedback equalizer -- Equalized pulse response -- Automatic Equalization Adaptation -- Performance Analysis -- Spice bit by bit -- Empirical convolution -- Peak distortion analysis -- Statistical analysis -- Solution from design of experiments -- Solution from Typical Models -- System Validation with Intel Devices -- Power-on Preparations -- Types of I/O Design Validation -- System Margining Validation Overview.
505 8# - FORMATTED CONTENTS NOTE
Formatted contents note DDR System Margining Validation -- High-Speed Serial I/O Margining Validation -- Low-Margin Debug Guidance -- Summary -- References -- Index.
588 ## - SOURCE OF DESCRIPTION NOTE
Source of description note Description based on publisher supplied metadata and other sources.
590 ## - LOCAL NOTE (RLIN)
Local note Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2024. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Digital electronics.
655 #4 - INDEX TERM--GENRE/FORM
Genre/form data or focus term Electronic books.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Krooswyk, Steven.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Ou, Jeffrey.
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Print version:
Main entry heading Zhang, Hanqiao
Title High Speed Digital Design
Place, publisher, and date of publication San Diego : Elsevier Science & Technology,c2015
International Standard Book Number 9780124186637
797 2# - LOCAL ADDED ENTRY--CORPORATE NAME (RLIN)
Corporate name or jurisdiction name as entry element ProQuest (Firm)
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://ebookcentral.proquest.com/lib/orpp/detail.action?docID=2166539">https://ebookcentral.proquest.com/lib/orpp/detail.action?docID=2166539</a>
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